Intel

Hacking on a @RealSenseai multi-camera GMSL pointcloud sync demo running on the new @intel Robinson Bay RDK. Stay tuned... https://t.co/1OtaMhTO67

Demanding Korean suppliers beat Chinese pricing while building 100,000 wafers per month misunderstands semiconductor supply economics. Wafer fab tools and pure chemical consumables are priced by yield and purity, not procurement leverage.…

Elon Musk just put dates on Terafab. According to Reuters, Musk said on the SpaceX earnings call that Terafab's first working SRAM test chip is targeted for May or June 2027 at the research fab in Austin. Volume production is targeted for…

"It took me three months to design it, but it's nine months until I can actually start to use it." Former Intel CEO Pat Gelsinger on the manufacturing bottleneck between designing hardware with AI and actually getting it built: "Let's say…

This is how you get rich ⚡️ You buy the macro dip in companies that are structural to building the future, with great management and a killer product roadmap. This is the time to add, into fear, into bad news, into uncertainty, not to…

Two @RealSenseai D457 GMSL stereo cameras now streaming on @intel Robinson Bay robotics developer kit! https://t.co/4z4DyY9i4B

TrendForce: MediaTek’s Google TPU v9 Shipments May Slip to 1Q28 Google’s TPU v9 project, involving MediaTek, could see its tape-out delayed until January 2027 following design revisions, with shipments potentially pushed back to the first…

"Intel is 80% done." That is how Lip Bu Tan described the turnaround at $INTC in a new interview with Nikkei. Since taking over in March 2025, he has replaced most of the senior leadership team, including bringing in the former CEO of SK…

Intel's CEO, Lip-Bu Tan, said China could catch up to U.S. semiconductor technology within 5-10 years. Regarding AI, he cited Moonshot AI's and DeepSeek as not technologically inferior to Anthropic or OpenAI and are significantly cheaper.…

JPMorgan expects $TSM to keep growing its CoWoS packaging capacity. - 130,000 wafers a month by the end of 2026. - 260,000 by the end of 2027. - 320,000 by the end of 2028. $INTC says its EMIB packaging is 30% to 40% cheaper. But JPMorgan…

Keybanc on Intel: Qualcomm's AI300 is expected to use EMIB-T AWS is evaluating EMIB-T for Trainium 4 Intel is getting meaningful traction with EMIB-M with design wins expected with AWS for Trainium 3 and Microsoft for its server CPU Cobalt…

According to Keybanc, Intel has secured design wins and has effectively secured firm commitments from several additional foundry customers including Broadcom (networking switch) and Google (server CPU). $INTC $AVGO $GOOG…

Oh yea! I just got my @RealSenseai D457 GMSL 3D stereo camera running on the new @intel Robotics Robinson Bay RDK compute! https://t.co/kfCYrcxAuA

TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration https://t.co/WYOjq9fqQh

Good stuff here. Basically all of the companies involved in near packaged optics are here. $COHR $LITE $CIEN $MRVL $INTC $AAOI https://t.co/eByDZuLJst https://t.co/AXMXXWUk7j

GOOD NEWS 🗞️ Tesla has released FSD v14.3 Lite for Model S&X running HW3 and Intel Atom processor 🔥 The update brings parking, unparking and reversing, Arrival Options, and the Speed Profiles, including the new Sloth mode 🔥…

Intel's D270 skips HBM entirely: up to 480GB LPDDR5X, 1.5TB/s, 1.3 PFLOPS FP8, 350W air-cooled PCIe. That is about a fifth of an HBM3E card's 8TB/s, but holds a 300B-param model in FP8. No price, no independent benchmarks yet. Memory…

SEMI: silicon interposers break down at scale. Intel CPU packages went from about 45x45mm to over 100x100mm, now 120x120mm. At 100x100mm a 300mm wafer yields four interposers or fewer. Bridges lead the next generation; glass substrates…

TrendForce Q4 contract prices: conventional DRAM +10-15%, NAND +15-20%, HBM +15-20%. Enterprise SSD demand up over 80% year on year as workloads shift from training to inference. Intel's CEO sees shortages lasting 2-3 years. GDDR6 output…

Hock Tan and Lip-Bu Tan at DBS Bank Conference: Hock Tan: "Most companies out there cannot find any bloody return on investment, im telling you, people are just wasting money, spending tokens, trying to understand." Lip-Bu Tan: "If you…

All OCP talks are posted on Youtube. That is incredible! Many many videos. https://t.co/RfmlGToiyt https://t.co/EF0J4HYraz

$AMAT just opened the largest joint chip research facility in the world, and all the major chipmakers are in it. The EPIC Center in Sunnyvale, California covers about 600,000 square feet, with nearly four acres of cleanroom space. Spending…

UBS: "EMIB-T execution is also better than feared. As we've been flagging, Ibiden's yield improvement is ahead of plan and have reached the ~50% target for mass production." $INTC

BSPD breaks a lot of the toolbox used for yield, fault isolation, inspection. BSPD adds new challenges for teardowns too, but we're getting pretty good at it. We present: Wildcat Lake, Intel 18A. Are you a passionate, high-achieving…

👇👇👇 https://t.co/fCxs46Z9ZG

$INTC, $QCOM, and $AMD have all reportedly raised CPU prices or are preparing to. Intel supposedly raised prices across its lineup starting last month, with the newest Panther Lake chips up 15 to 20% and older generations up 5 to 10%.…

Another round of CPU price increases have arrived. > Intel increasing prices on high-end Panther Lake processors by 15-20%. > Qualcomm ~10% for its multi-chip platform. > AMD is expected to announce a price increase. $INTC $QCOM $AMD

🇺🇸 @ElonMusk is recruiting for the massive Terafab semiconductor project in Texas, saying the value of its annual output could rank among the world’s 20 largest national economies. The planned Tesla-@SpaceX-Intel megafactory is designed…

Mizuho: Nvidia's server CPU revenue could grow to ~$60 billion in 2028E, and start becoming a leader in the server CPU market in 2027E. $NVDA $ARM $INTC $AMD

“The limiting factor will be turning the chips on,” Musk said. “You need power and transformers and cooling.” Inside TSMC, Texas, and the Terafab Tango https://t.co/VS2hdLGuR0

SK hynix paid $8.8 BILLION for Intel's NAND business in 2021 and now it could be worth over 10x that. According to Korean media, Solidigm has reportedly picked Goldman Sachs and Morgan Stanley to lead a United States IPO at a valuation…

Intel has been sharing its secret sauce, deepening its entrenchment in the Terafab project, according to my sources. https://t.co/3iiA94cO2H https://t.co/zq78WuUawF

Inside TSMC, Texas, and the Terafab Tango https://t.co/Vauee9FDQ1

Coming soon. Exclusive to @culpium subscribers later today. It's been a busy week of news, speculation, reaction and responses surrounding Intel, TSMC and Terafab. Make sure you're signed up when this piece drops. https://t.co/vIR00A0QoG…

🇺🇸EXCLUSIVE: @elonmusk says @Tesla’s real edge isn’t the cars; it’s the custom manufacturing equipment most people never see. After touring Intel, Samsung, and TSMC chip fabs, he told @teslaownersSV at @theXtakeover he was shocked to…

Former CEO of Intel, Pat Gelsinger, sees more AI data center delays coming due to lack of energy capacity: "We just need more capacity, and fundamentally, energy capacity omewhat dampens how you fork we can get on AI. Because, you know,…

🇺🇸Intel will remain involved in @elonmusk 's Terafab chipmaking project, CEO Lip-Bu Tan told Bloomberg, despite discussions about potential cooperation with Taiwan’s TSMC. Musk has been exploring partners for the venture as he develops…

"Energy Capacity = Economic Capacity" Former Intel CEO Pat Gelsinger on why America's power grid is the ceiling on growth: "We went through 10 to 15 years where essentially I was taking coal offline at the rate I was adding renewables, and…

Former Intel CEO Pat Gelsinger on getting hired at 18, designing Intel's chips while finishing his PhD, and arguing with his Stanford professors: "I'm 16 years old. I accidentally win a scholarship. I go to tech school, skip my last year…

Former Intel CEO Pat Gelsinger with a16z's Raghu Raghuram and Guido Appenzeller on the next wave of semiconductor innovation and the physical constraints shaping the AI buildout: Drawing on his experience designing Intel's 386 and 486…

J.P. Morgan: our Tech research team highlights that the traditional LLM infrastructure has a GPU-heavy architecture, with CPU/GPU ratios of 1:4 to 1:8. For Agentic AI, that ratio shifts towards 1:1, and could even become CPU- heavier as…

Citi: we believe the CPU TAM expands from $29B in 2025 to $300B in 2030, or a 60% CAGR. $INTC $AMD $NVDA $QCOM

Bernstein: AI accelerator chiplet volume to more than double from 2025-2028E. $NVDA $AVGO $AMD $INTC

Morgan Stanley: We see the major customers of EMIB-M being Trainium3, upcoming Trainium 4 and its in-house server CPU. Average EMIB-T capacity is around 5kwpm in 2026, which we expect to further scale to 15-20kwpm in 2027 and 40-45kwpm in…

$2,599 buys a Windows laptop that Microsoft says renders AI images 4.3 times faster than a 16 inch MacBook Pro on M5 Pro. The marketing is aimed squarely at Apple. The architecture underneath is aimed at something bigger: deciding, task by…

AI agents will trigger the largest CPU supercycle in history. Mizuho estimates agentic CPU sockets will surge from 1.3 million in 2026 to 16 million by 2030. Including head node processors, AI could drive nearly half of all server CPU…

Microsoft Brings Powerful AI Directly to PCs https://t.co/t1sWe16biq

Intel shipped the first commercial backside power delivery and its first GAA transistors in Panther Lake. SemiAnalysis's teardown puts 18A compute logic density on par with TSMC N3E, and not ahead of N3P, N2 or Samsung SF2 — while the…

AI & TECH STOCK MARKET REVIEW The 10 biggest stories from today: 1. $NVDA hit another ATH and is close to becoming the first company ever worth $6 trillion. The stock is up ~28% this year, adding ~$1.2 trillion in market cap, making Nvidia…

Tower Semiconductor has the best SiPho foundry 👍 $TSEM $TSM $UMC $GFS $INTC https://t.co/mK82Hx1hDi

Capital only buys the cleanroom. Advanced lithography and deposition tools get a fab to the starting line. Sustained wafer yield comes down to the process engineers on the floor managing drift. https://t.co/PZIPnPS6Yw

Bernstein: DRAM and NAND with the largest change in semiconductor ASPs, +282.3% YoY and +396.5% YoY, respectively. Logic is 3rd at 26.3%. $MU $DRAM $EWY $INTC $AMD $NVDA

📢 @neousys has launched the Nuvo-2860VTC, a compact fanless in-vehicle computer designed with Intel Atom processing, rugged M12 PoE+ networking, and flexible expansion for real-time fleet and surveillance deployment requirements Read more…

This 67-gram robot can climb up plant stems and build a 3D model to autonomously navigate among branches and leaves. The hope? To eventually find pests hidden among leaves before they cause crop damage. The research team designed the robot…

🚨 BREAKING: @Cognex_Corp is acquiring @RealSenseai for $500 million! 💰 439 days ago, RealSense spun out of Intel as an independent company. Their CEO Nadav Orbach signed a lease, moved into offices in Cupertino, Beijing and Haifa, and…

Posted five days ago. With no reshares. I think everyone missed: "Here's Claude Fable 5.1 doing the same on an ARX R5 with a wrist depth camera (Intel RealSense D405) — no demos, no training, no VLA, no hand-eye calibration, no teleop. The…

Is EMIB really chipping away at CoWoS? CoWoS has owned advanced packaging for years. TSMC keeps adding capacity aggressively but it still isn't enough to satisfy customer demand. Intel stepped in with a compelling alternative with EMIB —…

According to @FundaAI channel checks, they believe server CPU prices for Intel will increase again by at least 15% in Q4'26. "On the server CPU side, beyond prior hikes, our channel checks lead us to believe that prices will increase again…

CoWoS vs. EMIB comparison 🔥 Reticle size limit - EMIB Cost - EMIB Yield - CoWoS Scale - CoWoS $TSM $INTC https://t.co/Rlwc9qwDlo https://t.co/A1NwlYPZAE

Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics and high-density compute, per DigiTimes. The bet is that large-area glass processing from panel lines transfers to substrates.…

Google's 2027 Humufish TPU is slated for Intel's EMIB-T with MediaTek, but market rumors say CoWoS is being weighed as a backup as substrate yields lag; Unimicron previously targeted 50%, per DigiTimes. Sources still expect EMIB-T. Second…

This is an excellent visual connecting Taiwanese companies in the supply chain to major CPU companies. I suggest you all follow Liwei and help him get to 10,000+ 😍 $ARM $INTC $AMD https://t.co/fkSTy71wRs https://t.co/VLLu2P15uk

Evercore ISI: We expect Nvidia's market share to stabilize at around 80%, if not increase slightly, in 2027 driven by share gains at Anthropic and with the increasing use of open-source models. $NVDA $AVGO $INTC $AMD $MRVL

Google's Humufish TPU, mass production by end-2027, is set to use Intel's EMIB-T with ASIC partner MediaTek. Per DigiTimes, substrate yields lag and CoWoS is being weighed as a backup. The packaging decision is being made before the yield…

TSMC may double CoWoS capacity by 2028 on AI chip demand, per Communications Today. In the same week, Google is reportedly weighing CoWoS as a fallback for a TPU designed around Intel EMIB-T. A backup plan only works if the backup has…

Breaking: SanDisk is spiking today after Intel's CEO warned the memory shortage could get worse, saying Intel can currently meet only about half of customer chip demand Leopold Aschenbrenner first disclosed a ~$12,900,000 position in…

Piper Sandler: All the big customers (i.e. Amazon, Apple, AMD, Google, Tesla, Microsoft, Nvidia, Qualcomm etc) are evaluating Intel's 14A process as companies look for alternative foundry/packaging suppliers to TSMC considering it is…

Intel’s CEO just revealed where the next massive wave of AI spending could go (Save this). Lip-Bu Tan says memory, connectivity, optics, power and cooling are quickly becoming the biggest bottlenecks in AI. Here are five stocks positioned…

Excellent expert call conducted by Damnang with an Intel Foundry employee. To no one's surprise, the expert says: "Memory is the main bottleneck I currently see. Bandwidth matters, but moving data between different memories also consumes a…

CEO of Intel, Lip-Bu Tan, mentions memory, power, high speed connectivity, optical, and liquid cooling as critical semiconductor supply chain constraints: "I think a lot of people didn't realize — at the beginning of last year, I said…

CEO of Intel, Lip Bu-Tan, mentions memory, power, high speed connectivity, optical, and liquid cooling as critical semiconductor supply chain constraints: "I think a lot of people didn't realize — at the beginning of last year, I said…

CEO of Intel, Lip Bu-Tan, mentions memory, power, high speed connectivity, optical, and liquid coolings and critical semiconductor supply chain constraints: "I think a lot of people didn't realize — at the beginning of last year, I said…

$NBIS INCREASE ON-DEMAND GPU RATES EFFECTIVE OCTOBER 1. H100: $3.85 per GPU-hour -> $4.50 H200: $4.50 per GPU-hour -> $5.40 B200: $7.15 per GPU-hour -> $8.50 B300: $7.85 per GPU-hour -> $9.50 AMD EPYC Genoa CPU and memory rates will also…

The AI datacenter semiconductor market is expected to grow from $250 billion in 2025 to $1.3 trillion by 2030. $INTC $AMD $NVDA $AMZN $MU $CRDO $AVGO https://t.co/Udp2o1PDba https://t.co/gsPPccKlXD

BofA: adding a layer of policing and monitoring in AI could increase compute cost by 25%. $NVDA $AMZN $AMD $INTC $MSFT $GOOGL $META

Over the past two weeks, hedge funds bought U.S. tech stocks at the fastest pace since mid-2025. Net longs added were led by U.S. semiconductor and semicap companies, which explains the start of September "pump" seen in names like INTC,…

Move the target. The robot finds it again. This visual grasping pipeline combines #IntelRealSenseD405 + #reBotArmB601-RS + #ROS2 + #YOLOE: Detection → Depth → Hand-Eye Calibration → Grasp Pose → Pick & Place Move the pen, and the system…

Morgan Stanley has CapEx of CSPs ~12% in 2028, with spending on AI semiconductors expected to increase even more. > CoWoS/CoPoS/EMIB-T capacity is estimated to grow by 50% in 2028, while infrastructure spending (such as factories and AI…

TSMC would take CoWoS from 130k wafers/month at end-2026 to 260k by end-2028, per Taiwanese media, expanding Arizona and AP7. Analysts put Intel's EMIB-T at 40k-45k CoWoS-equivalent in 2028; overflow already goes to Amkor, UMC and ASE.…

Citi: We believe the CPU TAM expands from $29B in 2025 to $237B (previously $137B) in 2030, or a 52% CAGR. Sgentic CPUs to represent 52% of the TAM by 2030. $AMD $INTC $QCOM $ARM $NVDA

Semiconductor Supply Chain Ecosystem Via PDF Solutions slide deck $ASML $TSM $INTC $TSEM $NVDA $MRVL $AVGO

🚨Leopold/Situational Awareness returns? Since last Friday, there's been a string of significant Flex calls bought in concentrated AI names: $315M total options premiums / $1.1B of delta / $5.8M of vega. Positions: - $SNDK: Jan 2040/2200…

🇺🇸 RNC - Trump on “saving Intel”: “I’m the only one that can help you. Give the United States of America 10% of Intel, and I’ll get this problem solved for you,” he said. “I should’ve asked for more.” Live at the @Republicans Midterm…

Breaking: The Trump administration's Intel stake is now worth $45,300,000,000 They paid $8,900,000,000 for a 9.9% stake in $INTC back in August 2025 https://t.co/K6dC7hRr7G

Intel's US$23B August equity raise was pre-funding, not distress, per CFO David Zinsner: it equips fabs in Ireland, Arizona and Oregon for EMIB-T packaging and CPU capacity. DRAM demand will be handled through partners, not Intel fabs.…

Yeah guys, I perfectly timed the bottom. I sat on cash for weeks and waited for the right moment to buy. Rather than aimlessly buying the semis falling knife after Leopold got liquidated. - $BE up 33%: thanks to $SPY inclusion. - $NBIS up…

UBS: On Intel’s EMIB-T, industry feedback is positive regarding the yield improvement and overall execution, consistent with what we highlighted in July. We are constructive on EMIB-T’s supply supporting >2m substrate volume for MediaTek’s…

IDM vs. Fabless vs. Foundry : Who Creates OSAT Demand? 1. IDM ( Integrated Device Manufacturer) IDMs such as Intel, Texas Instruments and STMicroelectronics design and manufacture their own chips. Historically, they have also handled much…

The next glass-substrate fight may not be about panel size. It may be about thickness. Philoptics (KRX: 161580) said today that it will exhibit a 510 × 515mm glass substrate at KPCA Show in Incheon this week. The panel is 2.0mm thick. That…

Why did Intel abandon EMIB for their 2027 Diamond Rapids CPU? Uniform Memory Access. All CPU cores in each CBB can access all 16 memory channels with a single hop. UCIe-S through the substrate was required to route signals underneath the…

$12.9B is not a model acquisition. It is a distribution acquisition.NVIDIA just locked in the largest AI developer community on the planet: 18M developers, 3M models, 500K datasets, 1M apps. Jensen's team is not buying Hugging Face for…

A materials company is drawing the crowd because the format question got settled first. Last month I wrote that Resonac (TSE: 4004) and Intel ($INTC) were building to the same glass panel format, 510x515 mm. Once the format is fixed, the…

Bought some stocks today...finally. 1. $NBIS - Already a top 10 position for me, but one of my highest conviction names. 2. $INTC - I don't own enough Intel. 3. $CRDO - Averaging my position down on this earnings drop (I personally think…

Elon Musk thinks humanoid robots could become a bigger industry than almost anyone expects (Save this). @elonmusk said the usefulness of a humanoid robot depends on three factors, the quality of its artificial intelligence software, the…

NVIDIA guides $108B with zero from China, Ericsson measures 10% against Nokia's 100% promise, Intel splits silicon in three, Waymo picks Munich for 2027.